Staff Package Design Engineer- experienced in package development of power SiP/module

Job Description

+ Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging.
+ Strong understanding on wafer processing such as Front side of metal/Backgrind Backmetal, Taiko Backgrinding, Glass carrier bonding&grinding, Patterned back metal, Embedded die in substrate
+ Package technologies qualification for consumer & industrial power as well as automotive power applications.
+ Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
+ Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
+ Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
+ Resolve all process integration iss...