Job Title: Integrated Circuit Package Design Engineer

Job Description

We are seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed Ser Des and very-high-power delivery needs. You will be part of a worldwide R& D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5 G base stations. These designs include Ser Des at 224 G and higher, 5 G RF/Microwave ADC/DAC, HBM, DDR5, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new designs and contribute to efficiency improvements for our design team.

Responsibilities

Design complex flip-chip-BGA packages for high-speed Ser Des and high-power delivery needs.

Collaborate with the worldwide R& D team to develop high-performance package designs for ASICs used in AI, networking,...