To help grow our organization we are looking for an Advanced Packaging Lead to collaborate with a bright group of engineers to tackle complex and interesting problems at the intersection of AI and hardware.

Responsibilities

• Develop advanced packaging solutions for next generation AI products
• Collaborate with internal stakeholders, product, architecture and design to analyze and propose packaging solutions to improve performance, reliability and manufacturability
• Drive technical decisions, short-term and long-term, on packaging solutions, chiplet strategy and die-to-die interfaces
• Manage and collaborate with external suppliers, foundry and OSAT to propose leading-edge packaging solutions
• Review electrical, thermal, mechanical and feasibility data from suppliers and lead analysis through high volume production
• Resolve quality and integrity issues related to package design
• Drive long term plans to grow internal...